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RoHS Initiative means more than “get the lead out” As our industries moves closer to the June 30, 2006 date, we find our customers looking for “RoHS compliant” parts to replace their traditional “leaded components”. Argo is poised and able to produce RoHS compliant assemblies for our customers and already has a great deal of experience with alternative solder chemistries and higher temperature melting points. We have learned much from our board suppliers and other industry specialists regarding the bare printed circuit board requirements and based on your needs, can also recommend the most logical board chemistry for your assemblies. Argo does recognize that each assembly must operate within our customer’s specifications and it is for this reason that Argo cannot arbitrarily recommend replacement “RoHS compliant” components to replace the existing “leaded components” and cannot guarantee that the finished assemblies will operate within customer specifications with the new chemistries. It is our customer’s responsibility to identify qualified replacement components that will adhere to the new standards. |
Surface
Mount (SMT/SMD), Custom Hybrid Chip On Board (COB) and Through Hole (T.H.)
Electronic Assemblies. ISO9001:2000 Certified. BGA's, QFP's, 0402
chip components, Flex circuits, micro assemblies, Chip-on-board and Flip Chips
to Wiring, testing, wire bond and Box Builds, Argo Transdata has the know how
and capability to do it all. We are a full service EMS Electronic
Manufacturing Service CEM Electronics Contract Manufacturer. Located in
Clinton, Ct., performing work in Connecticut, Conn., Massachusetts, Mass., Rhode
Island, New York, the Northeast, New England, the USA and everywhere you are.
Approved Military Supplier. Potting, conformal coating, underfill, CAD,
Reflow, Wave, Pemnuts, Press Fit, Component Prep, Depanel, Testing, Test, Silver
Epoxy, Die bonding, Dice, Unicam, Contact System, Mydata, Gerbcam, capacitors,
rectifiers, led's, resistors, ic's, diodes, ferrite beads, inductors,
transistors, transformers, relay, switch, voltage regulator, light emitting
diodes (LED's), dpak, sot, melf, axial, radial, chip, potentiometer, ceramic hybrids,
ceramic disc, ESD compliant, pcb design, solder stencil, lead frame mounting.
Mixed Technology, best, greatest, fastest, 24 hour quick turn,IPC-610, IPC-600.
AOI Viscom, automated optical inspection.
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