Founded in 1969 as a contract manufacturer, Argo has
continually held a position at the forefront of circuit
miniaturization technology. Our initial products were very
high-density resistor networks for scientific research
applications at universities and other research
institutions. From these networks, thick and thin film
ceramic hybrid circuit assemblies were a natural growth
step.
In the mid 1970s Argo helped pioneer a new
technology called Chip On Board (COB) and various Multi Chip
Module (MCM) designations. COB forms the initial basic step
for Ball Grid Array (BGA) technology.
As active
Surface Mount components began to appear in the 1980’s, we
saw the manufacturing economies possible and developed the
processes to capture this new technology. Equipment for
solder paste screening, automatic component placement,
reflow soldering and assembly cleaning was installed. We
again helped pioneer the combining of all these technologies
to produce circuit layouts designed for size/cost
optimization.
Argo has been
involved in the design and manufacture of high quality
miniaturized electronic circuits to general industry since
1975. Argo is well established in the industry and we’ve
built our business on customer satisfaction. Our customers
will be glad to substantiate our claims of quality products
delivered on time. Call for a list of references.
