CHIP ON BOARD

CONTRACT ELECTRONICS MANUFACTURER

CHIP-ON-BOARD

For applications with the greatest space restrictions, Argo Transdata has a long history of working with micro-assemblies utilizing small SMD components, flip chips and bare wire bonded die.

CLICK TO VIEW SLIDE SHOW EXPLAINING THE CHIP-ON-BOARD PROCESS

Argo helped pioneer Chip On Board (COB): die on conventional PC board substrate. With the advent of surface mount technology, several years ago, passive components in small plastic packages, became available and cost effective. ARGO helped pioneer this newer chip on board technology. COB rivals, and in many applications surpasses, the density of ceramic substrates since components can be economically placed on both sides of the board.

DIECLOSE.JPG (21732 bytes)

Close Up of Die Showing wires and wire bond points.

COB Circuit before epoxy moisture shields are added (note the die bonds).

To use both sides of the board, the passive and active surface mounted components are set in place on one side of the PC board and passed through the reflow oven to melt and cure the solder paste. Then, the integrated circuit dice are epoxied in place and the wires are bonded between die connection points and PC board pads, as in a traditional hybrid. The circuit is then tested and physically packaged.

Many trade offs enable the most cost effective small package. The cost factors are: component cost, type PC board stock (temperature range, ruggedness, etc.), mix of die and passive components, and use of both sides of the board (reduction in total PC board material used).

Some components (capacitors, transformers, etc.) are only available in through hole packages. COB technology can also accommodate these through hole components.

For More Information Contact:

Argo Transdata Corp.
1 Heritage Park, Clinton CT, 06413
Tel: 1-860-669-2233
FAX: 1-860-669-4316
E-mail: quotes@argotransdata.com

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Surface Mount (SMT/SMD), Custom Hybrid Chip On Board (COB) and Through Hole (T.H.) Electronic Assemblies. ISO9001:2000 Certified. BGA's, QFP's, 0402 chip components, Flex circuits, micro assemblies, Chip-on-board and Flip Chips to Wiring, testing, wire bond and Box Builds, Argo Transdata has the know how and capability to do it all. We are a full service EMS Electronic Manufacturing Service CEM Electronics Contract Manufacturer. Located in Clinton, Ct., performing work in Connecticut, Conn., Massachusetts, Mass., Rhode Island, New York, the Northeast, New England, the USA and everywhere you are. Approved Military Supplier. Potting, conformal coating, underfill, CAD, Reflow, Wave, Pemnuts, Press Fit, Component Prep, Depanel, Testing, Test, Silver Epoxy, Die bonding, Dice, Unicam, Contact System, Mydata, Gerbcam, capacitors, rectifiers, led's, resistors, ic's, diodes, ferrite beads, inductors, transistors, transformers, relay, switch, voltage regulator, light emitting diodes (LED's), dpak, sot, melf, axial, radial, chip, potentiometer, ceramic hybrids, ceramic disc, ESD compliant, pcb design, solder stencil, lead frame mounting. Mixed Technology, best, greatest, fastest, 24 hour quick turn,IPC-610, IPC-600. AOI Viscom, automated optical inspection.
Last modified: 12/03/07