Flexibility Guaranteed

Argo Transdata Corporation Specializes in Surface Mount (SMT), Custom Hybrid Chip On Board (COB), and Through Hole Electronic Assemblies. We have the technology and capabilities to incorporate and mix all of these technologies and combine multiple subassemblies to housings and cabinetry as we supply complete assemblies to our customers. From BGA's and Flip Chips to Wiring and cable assemblies and Box Builds, Argo Transdata has the know how and capability to do it all.

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• Bare Die Attach
• Wire Bonding
• Surface Mount Technology
• Through Hole
• Potting and Conformal Coating
• ICT & Functional Testing
• Automated Selective Solder
• Cable and Harness Assembly
• Mechanical Assembly
• Kanban and other Stocking Options
• Custom Box Build