RoHS PCB Assembly

RoHS Compliance hit the Electronic Manufacturing Industry in February 2003 and was to take effect in the United States July 1st, 2006. The “Directive” was initiated by the European Union as a means to control and reduce the use and exposure of certain hazardous materials, not the least of which was lead (Pb). Lead had been used to some degree in almost all solders, solder pastes, components and bare printed circuit boards. The reduction or elimination of lead from the manufacturing process caused many component manufacturers, bare board houses, contract manufacturers and OEM’s to redesign their processes and equipment to accommodate the higher temperatures required to work without lead.

We have been able to refresh and upgrade our assembly lines and keep pace with the industry and offer RoHS PCB Assemblies before the July 1st, 2006 deadline. We helped many of our customers transition their products from leaded to RoHS Compliant PCB Assemblies, converting raw pcb materials, components and processes to produce a compliant product.

Segregating the RoHS components as well as Rohs PCB Assemblies from traditional leaded products was easily accomplished and our assembly documentation and stringent process controls maintain 100% separation of these two types of assemblies. We can offer conversion services and help you migrate your assemblies from leaded to RoHS Compliant PCB Assemblies.

Argo Transdata a division of the Eastern Company, 1 Heritage Park Road, Clinton, CT 06413
tel: (866) 669-ARGO (2746) — local: (860) 669-2233 — fax: (860) 669-4316

We are an ISO9001:2015 certified Contract Electronic Manufacturer (CEM) offering Electronic Manufacturing Services (EMS) of Wire Bond, Surface Mount (SMT), Custom Hybrid Chip On Board (COB), and Through Hole Electronic Assemblies. We do medical, military, industrial and commercial assemblies with ROHS or leaded solder processing. Choose from Consignment, Turnkey or Full Service Supply Chain Management with Kanban stocking of your assemblies. We have Fuji AimexIIs and Mydata pick and place equipment, MPM Momentum HiE Screen Printers, ACE Selective Solder for both ROHS and leaded product, Viscom AOI and Wave Solder. From chips down to 01005, BGA's and Flip Chips to Wiring, cables assemblies, Box Builds, Conformal Coating and Electrical Testing, we have the expertise, the capacity and the technical capabilities to do it all. CT MA RI NY NH