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THROUGH HOLE THROUGH HOLE CONTINUES TO REMAIN A PROMINENT PART OF ELECTRONICS ASSEMBLY AND ARGO TRANSDATA CONTINUES TO MAINTAIN ALL THE EQUIPMENT NECESSARY TO HANDLE ANY THROUGH HOLE ASSEMBLY WORK.
CLICK TO VIEW SLIDE SHOW EXPLAINING THE WAVE SOLDER PROCESS While Argo does a good deal of through hole assembly, the larger part of our through hole work is in combination with COB and/or SMT assembly. |
Surface
Mount (SMT/SMD), Custom Hybrid Chip On Board (COB) and Through Hole (T.H.)
Electronic Assemblies. ISO9001:2000 Certified. BGA's, QFP's, 0402
chip components, Flex circuits, micro assemblies, Chip-on-board and Flip Chips
to Wiring, testing, wire bond and Box Builds, Argo Transdata has the know how
and capability to do it all. We are a full service EMS Electronic
Manufacturing Service CEM Electronics Contract Manufacturer. Located in
Clinton, Ct., performing work in Connecticut, Conn., Massachusetts, Mass., Rhode
Island, New York, the Northeast, New England, the USA and everywhere you are.
Approved Military Supplier. Potting, conformal coating, underfill, CAD,
Reflow, Wave, Pemnuts, Press Fit, Component Prep, Depanel, Testing, Test, Silver
Epoxy, Die bonding, Dice, Unicam, Contact System, Mydata, Gerbcam, capacitors,
rectifiers, led's, resistors, ic's, diodes, ferrite beads, inductors,
transistors, transformers, relay, switch, voltage regulator, light emitting
diodes (LED's), dpak, sot, melf, axial, radial, chip, potentiometer, ceramic hybrids,
ceramic disc, ESD compliant, pcb design, solder stencil, lead frame mounting.
Mixed Technology, best, greatest, fastest, 24 hour quick turn,IPC-610, IPC-600.
AOI Viscom, automated optical inspection.
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