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CONTRACT ELECTRONICS MANUFACTURER

THROUGH HOLE

THROUGH HOLE CONTINUES TO REMAIN A PROMINENT PART OF ELECTRONICS ASSEMBLY AND ARGO TRANSDATA CONTINUES TO MAINTAIN ALL THE EQUIPMENT NECESSARY TO HANDLE ANY THROUGH HOLE ASSEMBLY WORK.

CLICK TO VIEW SLIDE SHOW EXPLAINING THE WAVE SOLDER PROCESS

While Argo does a good deal of through hole assembly, the larger part of our through hole work is in combination with COB and/or SMT assembly.

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Insertion of through hole components is simplified by a Contact Systems CS400E semiautomatic insertion unit. The system directs the operator in locating, selecting  and properly orienting each component to be placed. Once components are placed the unit can automatically trim and fasten the leads to facilitate wave flow.

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Argo operates a Hollis GBS Mark III 16" dual wave flow unit that can handle boards up to 16 1/2 inches wide. The dual wave enables wave flow of properly designed SMT/through hole mixed technology boards in a single pass.

For More Information Contact:

Argo Transdata Corp.
1 Heritage Park, Clinton CT, 06413
Tel: 1-860-669-2233
FAX: 1-860-669-4316
E-mail: quotes@argotransdata.com

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Surface Mount (SMT/SMD), Custom Hybrid Chip On Board (COB) and Through Hole (T.H.)  Electronic Assemblies.  ISO9001:2000 Certified.  BGA's, QFP's, 0402 chip components, Flex circuits, micro assemblies, Chip-on-board and Flip Chips to Wiring, testing, wire bond and Box Builds, Argo Transdata has the know how and capability to do it all.   We are a full service EMS Electronic Manufacturing Service CEM Electronics Contract Manufacturer.  Located in Clinton, Ct., performing work in Connecticut, Conn., Massachusetts, Mass., Rhode Island, New York, the Northeast, New England, the USA and everywhere you are.   Approved Military Supplier.  Potting, conformal coating, underfill, CAD, Reflow, Wave, Pemnuts, Press Fit, Component Prep, Depanel, Testing, Test, Silver Epoxy, Die bonding, Dice, Unicam, Contact System, Mydata, Gerbcam, capacitors, rectifiers, led's, resistors, ic's, diodes, ferrite beads, inductors, transistors, transformers, relay, switch, voltage regulator, light emitting diodes (LED's), dpak, sot, melf, axial, radial, chip, potentiometer, ceramic hybrids, ceramic disc, ESD compliant, pcb design, solder stencil, lead frame mounting.  Mixed Technology, best, greatest, fastest, 24 hour quick turn,IPC-610, IPC-600.  AOI Viscom, automated optical inspection.
Last modified: 12/03/07  Hit Counter