Argo Transdata
has several methods for soldering through hole components:
traditional hand soldering, wave soldering and state of the
art selective soldering utilizing both ROHS and tin/lead
solder.
Argo Transdata
has the flexibility to build your quick turn assemblies and
the capacity to meet your high volume requirements.
Through hole
continues to remain a prominent part of electronics assembly
and Argo Transdata continues to maintain all the equipment
necessary to handle any through hole assembly work.
While Argo
Transdata does a good deal of through hole assembly, the
larger part of our through hole work is in combination with
COB and/or SMT assembly.
THROUGH HOLE ASSEMBLY PROCESSES
COMPONENT INSERTION
Insertion of through hole components is simplified by a
Contact Systems CS400E semiautomatic insertion unit. The
system directs the operator in locating, selecting and
properly orienting each component to be placed. Once
components are placed the unit can automatically cut and
clinch the leads to facilitate wave flow or selective
soldering. View slide show of component insertion
process.
WAVE SOLDER
PROCESS
Argo
operates a Hollis GBS Mark III 16" dual wave flow unit that
can handle boards up to 16 1/2 inches wide. The dual wave
enables wave flow of properly designed SMT/through hole
mixed technology boards in a single pass. View slide
show of wave soldering process.
SELECTIVE SOLDERING PROCESS
Argo
Transdata also has an
ACE KISS-104 Selective Solder System
that can handle boards up to 18" x 24" to meet all your ROHS or tin/lead selective soldering
needs. View video below.
ACE KISS-104 SELECTIVE
SOLDERING
Argo Transdata can be your partner building your
through hole component assemblies.