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1 Heritage Park

Clinton, CT 06413

tel:  (866) 669-ARGO(2746)

fax: (860) 669-4316

 

 

 
 

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Through Hole Assembly Capabilities

Argo Transdata has several methods for soldering through hole components:  traditional hand soldering, wave soldering and state of the art selective soldering utilizing both ROHS and tin/lead solder. 

Argo Transdata has the flexibility to build your quick turn assemblies and the capacity to meet your high volume requirements. 

Through hole continues to remain a prominent part of electronics assembly and Argo Transdata continues to maintain all the equipment necessary to handle any through hole assembly work. 

While Argo Transdata does a good deal of through hole assembly, the larger part of our through hole work is in combination with COB and/or SMT assembly.

THROUGH HOLE ASSEMBLY PROCESSES

COMPONENT INSERTION

Insertion of through hole components is simplified by a Contact Systems CS400E semiautomatic insertion unit. The system directs the operator in locating, selecting  and properly orienting each component to be placed. Once components are placed the unit can automatically cut and clinch the leads to facilitate wave flow or selective soldering.  View slide show of component insertion process.


WAVE SOLDER PROCESS

 

Argo operates a Hollis GBS Mark III 16" dual wave flow unit that can handle boards up to 16 1/2 inches wide. The dual wave enables wave flow of properly designed SMT/through hole mixed technology boards in a single pass.  View slide show of wave soldering process.

 

SELECTIVE SOLDERING PROCESS

Argo Transdata also has an ACE KISS-104 Selective Solder System that can handle boards up to 18" x 24" to meet all your ROHS or tin/lead selective soldering needs.  View video below.

ACE KISS-104 SELECTIVE SOLDERING

 

Argo Transdata can be your partner building your through hole component assemblies.




 

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1 Heritage Park, Clinton, CT 06413

tel: (866) 669-ARGO(2746) *** local tel: (860) 669-2233 *** fax: (203) 669-4316.

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