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SMD ARGO TRANSDATA HAS THE HIGH SPEED TECHNOLOGY TO PLACE SMD COMPONENTS FROM FINE PITCH IC’S, QFP’S AND BGA’S TO FLIP CHIP’S AND 0402 CHIP COMPONENTS.
CLICK TO VIEW SLIDE SHOW EXPLAINING THE SURFACE MOUNT PROCESS The current state of the art packaging is Surface Mount Technology (SMT), and Argo has been involved since it's inception. The board pictured above is typical, illustrating the use of both through hole and surface mount components.
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Surface
Mount (SMT/SMD), Custom Hybrid Chip On Board (COB) and Through Hole (T.H.)
Electronic Assemblies. ISO9001:2000 Certified. BGA's, QFP's, 0402
chip components, Flex circuits, micro assemblies, Chip-on-board and Flip Chips
to Wiring, testing, wire bond and Box Builds, Argo Transdata has the know how
and capability to do it all. We are a full service EMS Electronic
Manufacturing Service CEM Electronics Contract Manufacturer. Located in
Clinton, Ct., performing work in Connecticut, Conn., Massachusetts, Mass., Rhode
Island, New York, the Northeast, New England, the USA and everywhere you are.
Approved Military Supplier. Potting, conformal coating, underfill, CAD,
Reflow, Wave, Pemnuts, Press Fit, Component Prep, Depanel, Testing, Test, Silver
Epoxy, Die bonding, Dice, Unicam, Contact System, Mydata, Gerbcam, capacitors,
rectifiers, led's, resistors, ic's, diodes, ferrite beads, inductors,
transistors, transformers, relay, switch, voltage regulator, light emitting
diodes (LED's), dpak, sot, melf, axial, radial, chip, potentiometer, ceramic hybrids,
ceramic disc, ESD compliant, pcb design, solder stencil, lead frame mounting.
Mixed Technology, best, greatest, fastest, 24 hour quick turn,IPC-610, IPC-600.
AOI Viscom, automated optical inspection.
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