Surface Mount SMT Assembly Capabilities

Argo Transdata has 3 High Speed Surface Mount Assembly lines with two Mydata MY9's and one Mydata MY12. 

Argo Transdata has the flexibility to build your quick turn assemblies and the capacity to meet your high volume requirements. 

Turnkey or Consignment, let Argo Transdata build your Surface Mount Assemblies.

·   ASSEMBLE BOARD SIZES UP TO 18" X 18" WITH NO MINIMUM SIZE

·   COMPONENT SIZES PLACED FROM 01005 TO 2.2" X 2.2"

·   PLACEMENT SPEEDS UP TO 21,000 CPH

·   PLACES 0.3mm (12 mil) PITCH BGA'S, QFP'S, CSP'S, CHIP SCALE BGA'S

· FULL VISUAL INSPECTION OF ALL COMPONENTS PRIOR TO PLACEMENT

· ELECTRICAL VERIFICATION OF ALL RESISTORS, CAPACITORS, DIODES, LED'S

· PLACEMENT ACCURACY of 15 μm at 3 sigma

· PLACES BARE DIE, 01005, 0201, 0402, FLIP CHIPS, CUSTOM PACKAGES

The current state of the art packaging is Surface Mount Technology (SMT) and Argo has been involved since it's inception. Surface Mount Technology produces assemblies with greater density and reliability than through hole.  Recognizing this, Argo Transdata began supplying custom SMT circuits since 1984.  Argo Transdata now assembles a wide variety of SMT circuits including mixed technologies that include SMT, COB and through hole components.

Argo Transdata can be your partner building your SMT assemblies.