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HYBRIDS Next to custom Integrated Circuits, chip and wire hybrids represent the most dense packaging available. The integrated circuit dice are epoxied or soldered to a carrier (substrate) and very fine wires are ultrasonically bonded between pads on the dice and pads on the substrate material to provide electrical connections.
Industrial Quality Hybrid Circuits.
Conventional hybrid: Die on ceramic substrate. Argo's pick and place equipment can automatically place all but the smallest die and our people are highly trained and experienced in handling dice as well. Our two automatic and four manual bonders and our automatic dispensing equipment enable us to handle both your prototypes and volume production.
Since Argo specializes in commercial and industrial products; you save the overhead associated with most mil. hybrid manufacturers. You'll find our pricing competitive with any domestic assembler and with offshore venders for quantities under 10,000 pieces per year.
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Surface
Mount (SMT/SMD), Custom Hybrid Chip On Board (COB) and Through Hole (T.H.)
Electronic Assemblies. ISO9001:2000 Certified. BGA's, QFP's, 0402
chip components, Flex circuits, micro assemblies, Chip-on-board and Flip Chips
to Wiring, testing, wire bond and Box Builds, Argo Transdata has the know how
and capability to do it all. We are a full service EMS Electronic
Manufacturing Service CEM Electronics Contract Manufacturer. Located in
Clinton, Ct., performing work in Connecticut, Conn., Massachusetts, Mass., Rhode
Island, New York, the Northeast, New England, the USA and everywhere you are.
Approved Military Supplier. Potting, conformal coating, underfill, CAD,
Reflow, Wave, Pemnuts, Press Fit, Component Prep, Depanel, Testing, Test, Silver
Epoxy, Die bonding, Dice, Unicam, Contact System, Mydata, Gerbcam, capacitors,
rectifiers, led's, resistors, ic's, diodes, ferrite beads, inductors,
transistors, transformers, relay, switch, voltage regulator, light emitting
diodes (LED's), dpak, sot, melf, axial, radial, chip, potentiometer, ceramic hybrids,
ceramic disc, ESD compliant, pcb design, solder stencil, lead frame mounting.
Mixed Technology, best, greatest, fastest, 24 hour quick turn,IPC-610, IPC-600.
AOI Viscom, automated optical inspection.
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