Chip on Board Bare Die Attach Wire Bonding

For applications with the greatest space restrictions, Argo Transdata has a long history of working with micro-assemblies utilizing flip chips and bare die attached wire bonded COB components.

Advanced interconnect via wire-bonding is a core competency of Argo Transdata.  utilizing gold (Au) or aluminum (Al) ultrasonic wedge bonding,  our interconnect expertise with COB can be an integral part of meeting your complete assembly needs that include SMT, Through Hole and Imbedded components.

Turnkey or Consignment, let Argo Transdata build your Chip On Board Assemblies.

·   MANUAL AND AUTOMATED WIRE BONDING

·  GLOB TOP ENCAPSULATION

·  DAMMING

·   UNDERFILL

·   LEAD FRAME AND HEADER ATTACHMENT HERMETICALLY SEALED

·  CERAMIC AND GLASS-EPOXY LAMINATE (FR4, ISOLA) HYBRID SUBSTRATES

· CUSTOM HYBRID ASSEMBLIES UTILIZING COB WITH SMT, THROUGH HOLE AND IMBEDDED COMPONENTS

· CUSTOM MICRO FIXTURING ELECTRICAL TEST FOR COMPLETE VERIFICATION OF FINAL PRODUCT

· FULL OR PARTIAL POTTING AND CONFORMAL COATING

· FLEX CIRCUITS AND FLEX-RIGID HYBRIDS AVAILABLE

Argo Transdata helped pioneer Chip On Board (COB) die on conventional PC board substrate in the 1970's. With the advent of surface mount technology passive components in small plastic packages became available and cost effective.  COB rivals, and in many applications surpasses, the density of ceramic substrates since components can be economically placed on both sides of the board.

Argo Transdata is capable of producing circuits utilizing the three predominant technologies of COB, SMT and through hole and can assist with all phases of production from design through final assembly.

Argo Transdata can be your partner building your COB assemblies.